Process Cooling and Heating System

Cooperate With Lithography machines, Etching machines, Ion Implantation machines, Cleaning machines, Vapor deposition equipment, etc

Liquid &Gas temperature control technology, mainly used for temperature testing simulation in semiconductor testing, with wide temperature orientation and high temperature rise and fall, temperature range -85 ℃~250 ℃, suitable for various testing requirements. LNEYA actively explores and researches component testing systems, committed to solving the problem of temperature control lag in electronic components. Cooling technology can be directly cooled from 300 ℃. This product is suitable for precise temperature control needs of electronic components.

In the manufacturing of semiconductor electronic components used in harsh environments, the testing phase of IC packaging assembly, engineering, and production includes electronic cold and hot testing at temperatures (-85 ℃ to+250 ℃) and other environmental testing simulations.

The above 5 processes are the front-end processes for semiconductor manufacturing, among which etching, ion implantation, thin film deposition, and diffusion require temperature control systems in 4 processes, and VOC treatment in 3 processes.

The subsequent packaging and testing process also requires a temperature control system.